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The projects include thin batteries, printed audio speaker systems, and flexible fan-out wafer level packaging advances.
March 8, 2019
By: Anthony Locicero
Copy editor, New York Post
SEMI-FlexTech announced new projects featuring novel interconnect and integration strategies to move innovations to market-ready products. The projects include thin batteries, printed audio speaker systems, and flexible fan-out wafer level packaging advances. “The SEMI FlexTech R&D program is driving significant advances in the infrastructure required to support world-class manufacturing capabilities for FHE devices and products,” said Dr. Melissa Grupen-Shemansky, SEM...
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